Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 29, 2008
Patent Application Number
11331619
Date Filed
January 13, 2006
Patent Primary Examiner
Patent abstract
An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands. Adjacent edge clusters about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis to identify defects. The edge pixel bins are also analyzed via blob analysis to determine defects.
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