Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 6, 2008
Patent Application Number
11207737
Date Filed
August 22, 2005
Patent Primary Examiner
Patent abstract
A multi-layer wick structure of the heat pipe, comprising a hollow heat pipe body and a weave mesh of the wick structure provided on the internal surface of the heat pipe body, wherein the weave mesh of the wick structure is subjected to at least one folding such that the periphery thereof is curled into a circle. By folding the weave mesh of the wick structure, it can be formed into a multi-layer structure. Then, after inserting the multi-layer wick structure and by the shrinking process of the heat pipe body, the wick structure can be tightly attached to the internal surface of the heat pipe body, thereby to increase the capillary force of the heat pipe and the amount of liquid to be delivered.
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