Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sang-Ho An0
Tae-Gyeong Chung0
In-Ku Kang0
Date of Patent
May 6, 2008
0Patent Application Number
111034790
Date Filed
April 12, 2005
0Patent Primary Examiner
Patent abstract
A multi-chip package and method for manufacturing are disclosed. The multi-chip package may include a substrate, a lower semiconductor chip mounted on the substrate, a first electrical connection for electrically connecting the substrate and the lower semiconductor chip, an upper semiconductor chip attached to the lower semiconductor chip and having overhang portions, and at least one bump interposed between the substrate and the overhang portions. The at least one bump may support the overhang portions and may be formed when the first electrical connection is formed.
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