US Patent 7368824 Diffusion solder position, and process for producing it
Patent 7368824 was granted and assigned to Infineon Technologies on May, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Edmund Riedl0
Khalil Hosseini0
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Article (+436 characters)
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Patent abstract
A diffusion solder position between two parts has intermetallic phases formed by two solder components. Nanoparticles of a filler material are three-dimensionally distributed in its diffusion region in addition to the intermetallic phases. Furthermore, a process for producing the diffusion solder position and for producing an electronic power component, which has a plurality of diffusion solder positions, is provided.
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US Patent 07368824 Diffusion solder position, and process for producing it US Patent 7368824 Diffusion solder position, and process for producing it
Infobox
Patent Number
073688240
Patent Number
73688240
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073688240
Date of Patent
May 6, 2008
0Patent Application Number
109276210
Date Filed
August 27, 2004
0Official Website
Patent Primary Examiner
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US Patent 07368824 Diffusion solder position, and process for producing it
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07368824
Date of patent
May 6, 2008
Patent application number
10927621
Date Filed
August 27, 2004
Patent primary examiner
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