Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Soo Min Kwak0
Young Kug Lim0
Heung Sun Kim0
Jong Han Kim0
Myoung Gu Kang0
Sang Seok Lee0
Date of Patent
May 13, 2008
0Patent Application Number
107129360
Date Filed
November 14, 2003
0Patent Primary Examiner
Patent abstract
A substrate bonding apparatus for fabricating an LCD device aligns upper and lower stages to accurately bond first and second substrates. The distance to which the upper and lower substrates are spaced apart from each other during bonding is adjustable depending on the determined thickness of the first and second substrates. Further, sealant material disposed on a substrate may be prevented from becoming contaminated by foreign material.
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