US Patent 7371152 Non-uniform subaperture polishing

A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the first portion, a sweep frequency that is a first rate of lateral motion for a polishing pad is selected to be substantially equal to an integer multiple of a rotation frequency that is a rate of rotation for the sample. The method further includes rotating the polishing pad at the polishing frequency, rotating the sample at the rotation frequency, and polishing the sample using the polishing pad while rotating the polishing pad and the sample.