US Patent 7372139 Semiconductor chip package
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Patent Inventor Names
Hee-seok Lee0
Kyung-lae Jang0
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Patent abstract
A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for connecting the chip pads of the semiconductor chip to the substrate bonding pads. The semiconductor chip and the electrical connections on the substrate may be encapsulated, and a board attached to a portion of a surface of the substrate may not be encapsulated.
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US Patent 07372139 Semiconductor chip package US Patent 7372139 Semiconductor chip package
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Patent Number
073721390
Patent Number
73721390
Edits on 25 May, 2023
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Official Website
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Patent Jurisdiction
Patent Number
073721390
Date of Patent
May 13, 2008
0Patent Application Number
111087940
Date Filed
April 19, 2005
0Official Website
Patent Primary Examiner
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US Patent 07372139 Semiconductor chip package
Infobox
Is a
Patent jurisdiction
Patent number
07372139
Date of patent
May 13, 2008
Patent application number
11108794
Date Filed
April 19, 2005
Patent primary examiner
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