Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jiangqi He0
Edward A. Zarbock0
Jiamiao Tang0
Daoqiang Lu0
Date of Patent
May 13, 2008
Patent Application Number
11452820
Date Filed
June 13, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.
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