US Patent 7373070 Optical fiber component package for high power dissipation

A package for an optical fiber device is disclosed. It has a high thermal conductivity packaging substrate surrounding the optical fiber device and has adhesive bonds at each end anchoring the optical fiber device to the substrate. The adhesive bonds are made of a material that has high transparency in damp heat as well as a high glass transition temperature and is capable of withstanding temperatures of over 100° C. The packaging substrate has a high absorption capacity and a CTE in relation to the CTE of the adhesive bond, such as to compensate for any variation in the adhesive bond due to temperature variations. This allows to limit mechanical stress in the optical fiber device within the package.