Patent attributes
A pressure sensor apparatus and a method of forming the same. A substrate (e.g., PCB) can be provided that includes a top side and a bottom side. A pressure transducer can be directly bonded to the top side of the substrate, wherein the substrate comprises substrate walls forming a plated through-hole that allows for the passage of a sensed media to contact a back side of the pressure transducer. Thereafter, a metal carrier with an integral port is bonded to the bottom side of the substrate, thereby forming a chip-on-board pressure sensor in which the need for a plating or coating to allow adhesion between the pressure transducer and the metal carrier is eliminated. The pressure transducer may comprise, for example, silicon or silicon bonded to glass. The metal carrier can be provided with a feature that mates with a valve such as a Schrader valve.
