US Patent 7378293 MEMS fabrication method

A method for singulating a substrate such as a semiconductor wafer populated with a plurality of MEMS devices. A preferred embodiment of the present invention comprises mounting a glass cover onto the wafer, then orienting the wafer and removably mounting it on an adhesive tape. A partial cut or series of partial cuts is then made through the cover to facilitate the later removal of selected cover portions using an automated process. The dice are then separated using a series of full cuts made perpendicular and parallel to the partial cuts and the selected cover portions removed from each die. The separated dice are then packaged for use or for further fabrication.