Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hirofumi Futamura0
Katsuo Kawaguchi0
Date of Patent
May 27, 2008
0Patent Application Number
105462980
Date Filed
April 16, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.