Patent attributes
A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the substrate and on which said heat-releasing plate of the electronic device is to be soldered, a through-hole formed in and penetrating said substrate and said land portion. The through-hole is adapted to release heat generated in the electronic device. The structure further includes a partitioning portion provided to be positioned between the heat-releasing plate and the land portion. The partitioning portion is adapted for preventing a solder, which should partially run out from a specific edge portion of the heat-releasing plate on soldering the heat-releasing plate to the land portion, from partially flowing into the through-hole.
