A room temperature infrared imager, fabricated using MEMS (Micro Electro Mechanical Systems) techniques, made up of individually functioning analog elements laid out in a horizontal and vertical block matrix (pixel array). The front of each individual pixel element is IR sensitive and varies its properties in proportion to the corresponding analog level of incident IR energy exposure. An image infrared energy is focused across the front of the array to ultimately create a visible light image. The detector elements are formed on the front of a substrate. On the rear of the substrate, right behind the detectors, are electronics which read the sensors exposure level. Formed on top of the electronics are Light Emitting Devices (LED's). The electronics vary the brightness of the LED's proportionally with the exposure level on the front of the detector. The image is formed by the different visible light levels that appear on the array readout.