Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ren-Hung Huang0
Chun-Huang Yu0
Date of Patent
June 3, 2008
Patent Application Number
11523902
Date Filed
September 19, 2006
Patent Primary Examiner
Patent abstract
A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory module. The clip holds the first heat-dissipating sheet and the second heat-dissipating sheet between which the fully buffered dual inline memory module is sandwiched.
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