US Patent 7383735 Pressure transducer package for a manifold

A package designed for monitoring fluid pressure in a manifold includes one or more pressure transducers and a microprocessor incorporated into a package to form a single, modular fluid pressure sensing device. The transducers may be arranged on one or more substrates to allow direct connection between the transducers and pressure ports in the manifold or be disposed on supports having support ports that couple with the pressure ports to carry fluid to the transducers. The package provides pressure-sensing capabilities without requiring reconfiguration of the manifold itself.