Patent 7384153 was granted and assigned to Seiko Epson on June, 2008 by the United States Patent and Trademark Office.
A light source device is provided comprising: a light-emitting element; a support member having the light-emitting element flip chip mounted thereto; and a thermally conductive filling agent between the light-emitting element and the support member. By injecting the filling agent between the light-emitting element and the support member, the thermal conduction is supplemented by the filling agent. As such, heat generated by the light-emitting element can be efficiently removed outside the light source device.