Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Joseph K. So0
Francis J. Kelley0
Hongyu Wang0
John Quanci0
Date of Patent
June 10, 2008
0Patent Application Number
108825670
Date Filed
July 1, 2004
0Patent Primary Examiner
Patent abstract
The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by weight copolymer of acrylic acid and methacrylic acid, and balance water, wherein the copolymer of acrylic acid and methacrylic acid has a monomer ratio (acrylic acid/methacrylic acid) in the range of 1:30 to 30:1 and the copolymer has a molecular weight in the range of 1K to 1000K.
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