US Patent 7385078 Energy-curable composition for making a pressure sensitive adhesive
All edits
Edits on 14 Sep, 2023
Golden AI
Edits made to:
Article (+393 characters)
Article
Patent abstract
An energy-curable polymer-forming composition for making a pressure sensitive adhesive includes an unsaturated oligomer resin and an adhesive promoter which increases the peel strength of the adhesive without reducing its tack. The composition also includes a tackifier and various other optional components such as photoinitiator, chain extender, reactive diluent and the like.
Edits on 24 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07385078 Energy-curable composition for making a pressure sensitive adhesive US Patent 7385078 Energy-curable composition for making a pressure sensitive adhesive
Infobox
Patent Number
0738507800
Patent Number
738507800
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 26 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073850780
Date of Patent
June 10, 2008
0Patent Application Number
102131740
Date Filed
August 6, 2002
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073850780
Date of Patent
June 10, 2008
0Patent Application Number
102131740
Date Filed
August 6, 2002
0Official Website
Patent Primary Examiner
Edits on 9 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 30 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07385078 Energy-curable composition for making a pressure sensitive adhesive
Infobox
Is a
Patent jurisdiction
Patent number
07385078
Date of patent
June 10, 2008
Patent application number
10213174
Date Filed
August 6, 2002
Patent primary examiner
Find more entities like US Patent 7385078 Energy-curable composition for making a pressure sensitive adhesive
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
