Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 10, 2008
Patent Application Number
11247612
Date Filed
October 10, 2005
Patent Primary Examiner
Patent abstract
A manufacturing method of an electronic part, comprises: sectioning a wiring substrate along a line intersecting a through hole, the wiring substrate having; a base substrate, a wiring pattern provided on a first surface of the base substrate, a reinforcement member provided on a second surface of the base substrate, and the through hole which is positioned so as to overlap partially an end of the reinforcement member and which extends through the base substrate.
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