US Patent 7385472 Multi-level printed circuit board interstitial vias
Patent 7385472 was granted and assigned to EMC on June, 2008 by the United States Patent and Trademark Office.
Is a
Date Filed
June 28, 2006
0
Date of Patent
June 10, 2008
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Patent Application Number
11427208
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Patent Inventor Names
Stuart D. Downes
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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