Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroki Taniyama0
Takayuki Toshima0
Osamu Kuroda0
Date of Patent
June 17, 2008
0Patent Application Number
103530150
Date Filed
January 29, 2003
0Patent Primary Examiner
Patent abstract
A substrate processing apparatus for processing a substrate With a processing fluid is provided. The apparatus includes holding members 60 for holding the substrate W, a chuck member 61 for supporting the holding members 60 and a top-face member 62 approaching the substrate W to cover its surface. In arrangement, since the top-face member 62 is supported by the chuck member 61, the holding members 60 can rotate together with the top-face member 62 in one body. With this structure, it is possible to reduce the influence of particles on the substrate W and also possible to provided a low-cost substrate processing apparatus occupied as little installation space as possible.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
