US Patent 7388392 Die design with integrated assembly aid

An upper die portion of a die head for aligning probe pins in first array of first micro-holes formed in lower die portion of the die head, which generally includes a spacer portion and is adapted to contact lower die portion is typically positioned between second surface and support frame and includes a second array of second micro-holes adapted to receive probe pins generally is in contact or close proximity to first assembly aid film and has a third array of third micro-holes adapted to receive probe pins and third array of third micro-holes are patterned to align with one another but are both offset with first array of first micro-holes by approximately the lateral distance between probe tip and probe head.