US Patent 7391596 High frequency integrated circuit pad configuration including ESD protection circuitry

A high frequency integrated circuit (IC) pad configuration includes a first IC pad, an inductor, and a second IC pad. The first IC pad is directly coupled to input or output a high frequency signal, wherein no electrostatic discharge (ESD) protection circuitry is directly coupled to the first IC pad. The inductor includes a first node and a second node, wherein the first node of the inductor is directly coupled to the first IC pad, and wherein the inductor has a high impedance with respect to a desired input or desired output impedance of the first IC pad at frequencies of the high frequency signal. The second IC pad is directly coupled to a power connection, to the second node of the inductor, and to an ESD protection circuit, wherein the inductor and the ESD protection circuit of the second IC pad substantially provides ESD protection for the first IC pad.