A transfer card structure includes a lower cover and an upper cover combined with the lower cover thereon. A terminal module is disposed between the upper cover and the lower cover. The terminal module has an insulation plate, a plurality of terminals, and an individual contact. The terminals and the individual contact are embedded in the insulation plate. The terminals include a plurality of touch portions and pin portions respectively on a front edge and on a rear edge of the insulation plate. A short portion is further arranged between the touch portions and the pin portions. The short portion includes a first bridge portion bent from a respective one of the terminals, and a second bridge portion bent from the individual contact. Therefore, a short circuit is caused via the terminals and the individual contact that connect with each other in order to lower production costs.