Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 1, 2008
Patent Application Number
11831030
Date Filed
July 31, 2007
Patent Primary Examiner
Patent abstract
A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.
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