Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 1, 2008
Patent Application Number
11374124
Date Filed
March 14, 2006
Patent Primary Examiner
Patent abstract
The plasma processing method comprises the step of removing an organic material film forming an upper layer relative to a patterned SiOCH series film by the processing with a plasma of a process gas containing an O2 gas, wherein the plasma has an O2+ ion density not lower than 1×1011 cm−3 and an oxygen radical density not higher than 1×1014 cm−3.
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