Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Eric Yakobson0
Christian Witt0
Qingyun Chen0
Richard Hurtubise0
Date of Patent
July 1, 2008
0Patent Application Number
118525130
Date Filed
September 10, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.
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