Patent attributes
In a wiring layer of a first layer of a multilayer wiring board, respective wiring patterns are drawn out from pads in an outermost portion of a pad placement region, from pads located on diagonal lines in the vicinities of the corners of the relevant region, and from pads located in diagonal directions between adjacent rows in an internal portion of the relevant region. Further, in each of wiring layers of second and subsequent layers, among pads electrically connected through via holes to the pads from which wiring patterns are not drawn out in a wiring layer of an upper layer, respective wiring patterns are drawn out from pads in an outermost portion of a pad placement region; and from pads located in diagonal directions between adjacent rows in an internal portion of the relevant region.
