Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 8, 2008
Patent Application Number
11602522
Date Filed
November 21, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
This invention is directed to the measurement of stress-strain relationships in thin films using substantially flat, parallel test surfaces with minimal width. This invention is further directed to the measurement of stress-strain relationships in thin films at controlled temperatures and at high strain rates above 100% per second.
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