Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jürgen Leib0
Dietrich Mund0
Date of Patent
July 8, 2008
0Patent Application Number
105115570
Date Filed
April 15, 2003
0Patent Primary Examiner
Patent abstract
A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that are to be joined substantially irrespective of material and for sensitive substrates. According to the process, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element.
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