US Patent 7397125 Semiconductor device with bonding pad support structure
Patent 7397125 was granted and assigned to NEC on July, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Noriaki Oda0
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Patent abstract
A semiconductor device having bonding pads on a semiconductor substrate includes: an upper copper layer that is formed on the lower surface of the bonding pads with a barrier metal interposed and that has a copper area ratio that is greater than layers in which circuit interconnects are formed; and a lower copper layer that is electrically insulated from the upper copper layer and that is formed closer to the semiconductor substrate than the upper copper layer.
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US Patent 07397125 Semiconductor device with bonding pad support structure US Patent 7397125 Semiconductor device with bonding pad support structure
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Patent Number
07397125
Patent Number
7397125
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US Patent 07397125 Semiconductor device with bonding pad support structure
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Is a
Current assignee
Patent jurisdiction
Patent number
07397125
Date of patent
July 8, 2008
Patent application number
10761204
Date Filed
January 22, 2004
Patent primary examiner
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