Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Taiga Matsushita0
Yasukazu Nakata0
Katsuyoshi Matsuura0
Date of Patent
July 8, 2008
0Patent Application Number
105673580
Date Filed
July 30, 2004
0Patent Primary Examiner
Patent abstract
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.
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