Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pek Chew Tan0
Cheng Siew Tay0
Eng Hooi Yap0
Date of Patent
July 15, 2008
Patent Application Number
10458603
Date Filed
June 10, 2003
Patent Primary Examiner
Patent abstract
An apparatus and system, as well as fabrication methods therefor, may include a substrate coupled to a first material and a second material. The first and second materials may comprise adjacent metals, and may have different coefficients of thermal expansion sufficient to reduce the amount of substrate warp that can occur due to heating and cooling.
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