Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 22, 2008
Patent Application Number
11558603
Date Filed
November 10, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
An interconnect assembly is provided for electrically connecting first and second circuit members. Each of the circuit members comprises an array of electrical contacts. The interconnect assembly includes a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the first and second circuit members. The interconnect assembly also includes a carrier defining a plurality of apertures for receiving the conductors and at least one retainer contacting each conductor. Each of the retainers has a maximum diameter that is greater than a minimum diameter of the apertures such that a portion of each conductor is retained within one of the apertures.
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