US Patent 7403388 Cooling system for server and server having the same

A cooling system in accordance with a preferred embodiment of the invention includes a chassis, a fan mounted in the chassis, a memory, and an air conducting cover, wherein the air conducting cover comprises two sidewalls mounted in the chassis, and a top wall connecting tops of the two sidewalls, the two sidewalls and the top wall cooperatively form an airflow channel, and the memory is in the airflow channel. Because the airflow channel is narrow, a more efficient airflow speed is achieved in the airflow channel. Thus, the cooling system effectively dissipates heat without encroaching on much needed space.