Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 29, 2008
Patent Application Number
11065126
Date Filed
February 24, 2005
Patent Primary Examiner
Patent abstract
Exemplary embodiments of the present invention provide a method of manufacturing a semiconductor device that can take a connection between layers without giving damage to a layer, which is underlying. The semiconductor device includes forming conductive members Ms and Md at a predetermined position of a semiconductor film, forming an insulating film on a whole surface of a substrate excluding the conductive members Ms and Md, and forming a conductive film that is connected to the semiconductor film with the conductive member Ms and Md.
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