US Patent 7407569 Gold plating solution and gold plating method
Patent 7407569 was granted and assigned to Mitsubishi Chemical Corporation on August, 2008 by the United States Patent and Trademark Office.
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A gold plating solution comprising iodide ions, gold iodide complex ions and a non-aqueous solvent, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution. The present invention further provides a gold plating solution comprising iodide ions, gold iodide complex ions, a non-aqueous solvent and a water-soluble polymer, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution and which is capable of forming a gold plating film in which gold crystal particle sizes are very fine and grain boundaries are dense. The present invention further provides a gold plating method employing such a gold plating solution.
US Patent 07407569 Gold plating solution and gold plating method US Patent 7407569 Gold plating solution and gold plating method
US Patent 07407569 Gold plating solution and gold plating method
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