US Patent 7408744 Impedance control with reduced stiffness contribution from electrical interconnect

Method and apparatus for reduced contribution to suspension hinge stiffness of an electrical interconnect metal layer while retaining substantial impedance reductions from the metal layer use a sinuous pattern of removed and retained subregions of the metal layer selectively and distributively to ease bending of the metal layer and decrease its stiffness contribution while the retained metal layer subregions provide a substantial proportion of the impedance reduction normally provided by the metal layer.