Patent attributes
A high frequency module comprises: a switch circuit connected to first and second antenna terminals; a first diplexer connected to first and second reception signal terminals and the switch circuit; a second diplexer connected to first and second transmission signal terminals and the switch circuit; and a layered substrate for integrating these components. The layered substrate includes a first region and a second region that are divided from each other by an imaginary plane that passes through the center of the bottom surface of the layered substrate and that intersects the bottom surface at a right angle. The first diplexer is located in the first region while the second diplexer is located in the second region. The locations of the first antenna terminal and the first and second reception signal terminals and the locations of the second antenna terminal and the first and second transmission signal terminals are symmetric with respect to the imaginary plane.
