Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 19, 2008
Patent Application Number
11017074
Date Filed
December 21, 2004
Patent Primary Examiner
Patent abstract
A multilayer interconnection layer is provided on a semiconductor substrate. An inductor is provided on an insulating layer that forms the uppermost layer of the multilayer interconnection layer. The inductor is formed by spirally arranging a single wiring. On the insulating layer, a multilayer structure body is provided in an inner region of the inductor. In the multilayer structure body, a plurality of ferromagnetic cores formed of Ni are arranged in a matrix. The height of each ferromagnetic core is equal to or larger than the width thereof.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
