US Patent 7417195 Circuit board and circuit board connection structure
Patent 7417195 was granted and assigned to Denso on August, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Fumio Kojima0
Makoto Totani0
Toshihiro Miyake0
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Patent abstract
A printed circuit board 2 and an FPC board 3 to be connected together are each given a multilayer structure wherein insulating films 23, 33 and interconnection patterns 22, 32 are stacked alternately. In the FPC board 3, connecting signal lines are distributed among the multilayered interconnection patterns 22, and in the printed circuit board 2, interconnecting to lands 32a formed on a connection face thereof is carried out using interconnection patterns 32 of inner layers. By this means, it is possible to greatly increase the number of connecting signal lines between the printed circuit board 2 and the FPC board 3.
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US Patent 07417195 Circuit board and circuit board connection structure US Patent 7417195 Circuit board and circuit board connection structure
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Patent Number
074171950
Patent Number
74171950
Edits on 19 May, 2023
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
074171950
Date of Patent
August 26, 2008
0Patent Application Number
107697630
Date Filed
February 3, 2004
0Official Website
Patent Primary Examiner
Edits on 9 Jun, 2022
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US Patent 07417195 Circuit board and circuit board connection structure
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07417195
Date of patent
August 26, 2008
Patent application number
10769763
Date Filed
February 3, 2004
Patent primary examiner
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