US Patent 7417870 Multi-layer board with decoupling function
Patent 7417870 was granted and assigned to Samsung on August, 2008 by the United States Patent and Trademark Office.
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A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.
US Patent 07417870 Multi-layer board with decoupling function US Patent 7417870 Multi-layer board with decoupling function
US Patent 07417870 Multi-layer board with decoupling function
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