Patent attributes
A method for manufacturing a semiconductor device comprises forming a laser marking, forming a trench pattern, forming a metal interconnection layer, removing a predetermined portion of the metal interconnection layer, and planarizing the metal interconnection layer. The laser marking is formed in a first region of a wafer, and the first region has a first width from an edge of the wafer. The trench pattern is formed above the wafer except for above the first region. The metal interconnection layer is formed above the wafer where the laser marking and the trench pattern are formed. The predetermined portion of the metal interconnection layer is removed, and the predetermined portion has a second width from the edge of the wafer equal to or greater than the first width. And the metal interconnection layer above the wafer where the trench pattern is formed is planarized to a predetermined thickness.
