Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
September 2, 2008
0Patent Application Number
112649030
Date Filed
November 1, 2005
0Patent Primary Examiner
Patent abstract
A semiconductor chip package has a pillar body including at least three conductors insulated from each other by an insulating layer. The pillar body has a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer. A plurality of semiconductor chips are attached on the mounting faces and selectively and electrically connected to the conductors. The semiconductor package of the present invention can be used in a semiconductor illuminator which has a housing having a reflecting cup, with the pillar body positioned inside the reflecting cup.
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