An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed between the socket pins and the test board and making the socket pins vertically elastic; a plurality of laser beam transmitters vertically penetrating the socket pins, the socket springs, and the test board; and a laser beam source supplying laser beams to the laser beam transmitters.