US Patent 7420809 Heat spreader in integrated circuit package
Patent 7420809 was granted and assigned to LSI Corporation on September, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 22, 2004
Date of Patent
September 2, 2008
Patent Application Number
10873387
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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