Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mark H. Eskridge0
Date of Patent
September 2, 2008
0Patent Application Number
113289920
Date Filed
January 9, 2006
0Patent Primary Examiner
Patent abstract
An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed of two or more thermotropic liquid crystal polymer (LCP) films laminated over a selected number of metal electrical conductors carrying signals into and out of package.
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