US Patent 7423348 Chip structure and chip package structure
Patent 7423348 was granted and assigned to Industrial Technology Research Institute on September, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 19, 2005
0
Date of Patent
September 9, 2008
0
Patent Application Number
11306160
0
Patent Inventor Names
Su-Tsai Lu
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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