Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
William J. Cummings0
Lauren Palmateer0
Manish Kothari0
Mark Miles0
Brian Gally0
Clarence Chui0
Jeffrey B. Sampsell0
Date of Patent
September 9, 2008
0Patent Application Number
110457380
Date Filed
January 28, 2005
0Patent Primary Examiner
Patent abstract
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
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